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M5STACK

M5Stamp ESP32S3 Module

Ürün Kodu : LTE-S007
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617,71 TL + KDV
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  • Description

    STAMPS3is a highly integrated embedded main control core module, using Lexin ESP32-S3FN8main control chip,8MSPI flash memory, equipped with high-performance Xtensa 32-bit LX7 dual-core processor, main frequency up to 240MHz. Built-in highly integrated 5V to 3.3V circuit, RGB status indicator, programmable button, module leads out ESP32-S3 all GPIO, and in the form of 1.27MM/2.54MM spacing lead, support SMT, DIP row, DIP row and Jump wireand other ways of use; The product features compact volume, strong performance, rich expansion IO and low power consumption. The module is suitable for IoT application scenarios with embedded main control modules.

    Features

    • ESP32-S3FN8(2.4GHz Wi-Fi)
    • Minimal system board
    • Multi-IO lead-out, support multiple application forms (SMT, DIP, flying wire)
    • Integrated programmable RGB LEDs and buttons
    • Support UIFlow graphical programming

    Includes

    • 1x StampS3
    • 1x HY2.0-4P terminal
    • 1 x 2.54-9P header
    • 1 x 2.54-6P header
    • 1 x Hex Key
    • 1 × User manual

    Applications

    • Smart home
    • Wearables
    • Medical equipment

    Specification

    Resources Parameters
    MCU ESP32-S3FN8
    DCDC Highly integrated MUN3CAD01-SC
    Flash 8MB
    Input voltage 5V
    Interactive Programmable physical buttons x 1, programmable RGB LED (WS2812B-2020) x 1
    Antenna type 2.4G 3D antenna
    Module resource interface Touch sensor, SD/SDIO/MMC master controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counter
    IO interface x23 G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39/G40/G41/G42/G43/G44/G46
    Connection method SMT/DIP (pitch 2.54mm and 1.27mm)/Jump Wire
    IO interface spacing 2.54mm和1.27mm
    Operating temperature 0°C to 40°C
    Product Size 26mm × 18mm × 5mm
    Package Size 136mm × 92mm × 13mm
    Product Weight 3.2g
    Package Weight 7.5g
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