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DescriptionSTAMPS3is a highly integrated embedded main control core module, using LexinESP32-S3FN8main control chip,8MSPI flash memory, equipped with high-performance Xtensa 32-bit LX7 dual-core processor, main frequency up to 240MHz. Built-inhighly integrated 5V to 3.3V circuit,RGB status indicator,programmable button, module leads outESP32-S3 all GPIO, and in the form of1.27MM/2.54MMspacing lead, supportSMT, DIP row, DIP row and Jump wireand other ways of use; The product features compact volume, strong performance, rich expansion IO and low power consumption. The module is suitable forIoT application scenarios with embedded main control modules.Features- ESP32-S3FN8(2.4GHz Wi-Fi)
- Minimal system board
- Multi-IO lead-out, support multiple application forms (SMT, DIP, flying wire)
- Integrated programmable RGB LEDs and buttons
- Support UIFlow graphical programming
 Includes- 1x StampS3
- 1x HY2.0-4P terminal
- 1 x 2.54-9P header
- 1 x 2.54-6P header
- 1 x Hex Key
- 1 × User manual
 Applications- Smart home
- Wearables
- Medical equipment
 SpecificationResources Parameters MCU ESP32-S3FN8 DCDC Highly integrated MUN3CAD01-SC Flash 8MB Input voltage 5V Interactive Programmable physical buttons x 1, programmable RGB LED (WS2812B-2020) x 1 Antenna type 2.4G 3D antenna Module resource interface Touch sensor, SD/SDIO/MMC master controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counter IO interface x23 G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39/G40/G41/G42/G43/G44/G46 Connection method SMT/DIP (pitch 2.54mm and 1.27mm)/Jump Wire IO interface spacing 2.54mm和1.27mm Operating temperature 0°C to 40°C Product Size 26mm × 18mm × 5mm Package Size 136mm × 92mm × 13mm Product Weight 3.2g Package Weight 7.5g 
 
 



 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
